In the fields of semiconductors, LEDs, and 3C electronics——
SOT252 transistor, alloy resistor, ceramic resistor, photoelectric lens mold, electronic chip
Remove overflow glue, residual glue, and perform precise surface cleaning.
The truly difficult thing is not 'unable to remove', but 'unable to remove completely'.
Residual glue, dead corner glue, tiny particles - a trace of residue that affects yield and stability.
Traditional chemical or manual methods: low efficiency, easy to scratch, corrode, poor consistency.
And high-precision devices cannot tolerate half a point.
Laser glue removal is becoming an increasingly popular choice for more and more companies
✔ Non contact, does not damage the substrate
✔ Thoroughly remove glue without chemical pollution
✔ Adapt to automation, stable and efficient
Without direct contact with the product, it is possible to achieve high cleanliness and precision adhesive removal. Not seeking to 'wash off the glue', but to 'wash' the glue thoroughly without damaging the product.
